run_thermal_analysis
shallowio.github.magiccadai/magicon · Verify this server
Run a full PCB thermal analysis: via array Rth, junction-to-ambient stack, Kennedy spreading, Coffin-Manson barrel stress, Timoshenko warpage, and resin-flow estimation. Mirrors POST /api/stackups/{id}/thermal-analysis. Call with no arguments once a design exists: the server takes power_w from the designed chain's dissipated power and defaults ambient_c to 25 C. The result carries `recommendations` (thermal vias, copper, plating) — answer adjustment questions from those entries. If the user states a heatsink or airframe spreader, pass `heatsink` (θcs, θsa and mount, all three as stated — never guessed); Tj is then computed through it instead of still-air convection.
1 trials · measured 1 day ago
run_thermal_analysis scores 100.0/100 on Vouch's measured behaviour index, from 1 real invocation trials against io.github.magiccadai/magicon, measured 6 Oct 2026 under methodology v0.2.0. Every measured component scored 100.
Component breakdown
| Component | Weight | Value |
|---|---|---|
| Reliability | 35% | not applicable |
| Schema integrity | 25% | 100.0 |
| Failure behaviour | 15% | not applicable |
| Latency | 15% | not applicable |
| Concurrency | 10% | not applicable |
Tool details
- Transport
- remote
- Credential class
- self-provisionable
- Input schema
- not declared
- Output schema
- not declared
- Side-effect classification
- unclassified
Score history
| Day | Score | Tier | Methodology |
|---|---|---|---|
| 2026-10-06 | 100.0 | shallow | v0.2.0 |
Probe evidence
| Probe | Outcomes |
|---|---|
| schema_integrity | pass: 1 |
Raw request/response logs are not archived yet — the outcome counts above are drawn directly from every recorded trial.
Embed this score
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