pcb_thermal
shallowengineer.calc/calc · Verify this server
Estimate PCB component temperatures by solving a thermal resistance network (thermal↔electrical analogy) with the built-in MNA solver. Each component gets a junction node (package θjb from a typical-datasheet table), a local board node coupled to its neighbours through in-plane FR4/copper conduction, and convection to ambient. Computes per-component junction and case temperatures, board extremes, and flags max-junction violations. Runs instantly in-worker; mesh-level CFD via container backend is planned.
1 trials · measured 8 days ago
pcb_thermal scores 100.0/100 on Vouch's measured behaviour index, from 1 real invocation trials against engineer.calc/calc, measured 25 Aug 2026 under methodology v0.2.0. Every measured component scored 100.
Component breakdown
| Component | Weight | Value |
|---|---|---|
| Reliability | 35% | not applicable |
| Schema integrity | 25% | 100.0 |
| Failure behaviour | 15% | not applicable |
| Latency | 15% | not applicable |
| Concurrency | 10% | not applicable |
Tool details
- Transport
- remote
- Credential class
- self-provisionable
- Input schema
- not declared
- Output schema
- not declared
- Side-effect classification
- unclassified
Score history
| Day | Score | Tier | Methodology |
|---|---|---|---|
| 2026-08-25 | 100.0 | shallow | v0.2.0 |
Probe evidence
| Probe | Outcomes |
|---|---|
| schema_integrity | pass: 1 |
Raw request/response logs are not archived yet — the outcome counts above are drawn directly from every recorded trial.
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[](https://vouch.tools/tools/9649884a-a395-4923-9975-2f0c727091e1)