get_packaging_costs

shallow

io.github.SiliconAnalysts/silicon-analysts · Verify this server

Returns two sub-arrays: `packaging` (per-tech cost benchmark + capability matrix for CoWoS-S/L, EMIB, SoIC, InFO-PoP, FC-BGA, FC-CSP, etc.) and `hbmSpecs` (HBM2 through HBM4 cost per stack + bandwidth/capacity). Optional `type` filter narrows packaging array to one technology. USE THIS for: packaging cost lookup, comparing CoWoS variants, getting HBM stack pricing for cost modeling. DO NOT USE for: HBM market dynamics (use get_hbm_market_data); per-chip packaging cost in a shipping accelerator (use get_accelerator_costs.costBreakdown.packagingCostUsd). Returns INVALID_PARAMS for unknown type. Refreshes monthly.

100.0/100

2 trials · measured 2 days ago

get_packaging_costs scores 100.0/100 on Vouch's measured behaviour index, from 2 real invocation trials against io.github.SiliconAnalysts/silicon-analysts, measured 31 Aug 2026 under methodology v0.2.0. Every measured component scored 100.

Component breakdown

ComponentWeightValue
Reliability35%not applicable
Schema integrity25%100.0
Failure behaviour15%not applicable
Latency15%not applicable
Concurrency10%not applicable

Tool details

Transport
remote
Credential class
open
Input schema
not declared
Output schema
not declared
Side-effect classification
read-onlyHeuristically read-only-eligible (readonly-heuristic.ts) and sample-called by the Phase 0 census shallow probe.

Score history

DayScoreTierMethodology
2026-08-31100.0shallowv0.2.0

Probe evidence

ProbeOutcomes
schema_integritypass: 1
sample_callpass: 1

Raw request/response logs are not archived yet — the outcome counts above are drawn directly from every recorded trial.

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Vouch score: get_packaging_costs
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get_packaging_costs — Vouch