pcb_via_current
shallowengineer.calc/calc · Verify this server
Calculate PCB via current-carrying capacity using the IPC-2221 standard. A plated via is a hollow copper cylinder whose cross-sectional area is the annular ring of plating: A = pi * (D - t) * t, where D is the drill diameter and t is plating thickness. The IPC-2221 empirical formula I = k * dT^0.44 * A^0.725 (k=0.048) then gives the maximum current for a given temperature rise. Also computes via barrel resistance from copper resistivity (1.724e-6 ohm-cm) and barrel length (board thickness). When a target current is specified, returns how many parallel vias are needed. Essential for power planes, high-current paths, and thermal via arrays. Chain with trace_width to verify both trace and via can handle the same current.
1 trials · measured 8 days ago
pcb_via_current scores 100.0/100 on Vouch's measured behaviour index, from 1 real invocation trials against engineer.calc/calc, measured 25 Aug 2026 under methodology v0.2.0. Every measured component scored 100.
Component breakdown
| Component | Weight | Value |
|---|---|---|
| Reliability | 35% | not applicable |
| Schema integrity | 25% | 100.0 |
| Failure behaviour | 15% | not applicable |
| Latency | 15% | not applicable |
| Concurrency | 10% | not applicable |
Tool details
- Transport
- remote
- Credential class
- self-provisionable
- Input schema
- not declared
- Output schema
- not declared
- Side-effect classification
- unclassified
Score history
| Day | Score | Tier | Methodology |
|---|---|---|---|
| 2026-08-25 | 100.0 | shallow | v0.2.0 |
Probe evidence
| Probe | Outcomes |
|---|---|
| schema_integrity | pass: 1 |
Raw request/response logs are not archived yet — the outcome counts above are drawn directly from every recorded trial.
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